发明名称 |
Semiconductor device-encapsulating epoxy resin composition containing secondary amino functional coupling agents |
摘要 |
Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.
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申请公布号 |
US5476884(A) |
申请公布日期 |
1995.12.19 |
申请号 |
US19940312672 |
申请日期 |
1994.09.28 |
申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
KAYABA, KEIJI;SAWAMURA, YASUSHI;TANAKA, MASAYUKI |
分类号 |
H01L23/29;(IPC1-7):C08L63/00;C08K7/08 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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