| 摘要 |
<p>A polishing pad capable of easily removing polished matter from the surface thereof after polishing, reducing the consumption of polishing fluid used for the polishing, and lowering the production cost thereof, wherein a plurality of elongated holes (11) passing through a first polishing pad (1) in thickness direction are provided in the first polishing pad (1) for polishing the polished matter, the elongated holes (11) are desirably formed so that the lengths thereof in longitudinal direction are 20 mm or shorter and the pitches thereof in lateral direction are less than 100 mm, and small holes (unshown) may be provided in the first polishing pad (1) in addition to the elongated holes (11).</p> |
