AMORPHOUS CARBON LAYER TO IMPROVE PHOTORESIST ADHESION

摘要

A semiconductor device (10), including an amorphous carbon layer (16) for improved adhesion of photoresist layers. Also a method of fabricating said semiconductor device. The device (10) includes a substrate (12) having a surface (15), an amorphous carbon layer (16), formed overlying the surface (15) of the substrate, and a low surface energy material (14) layer overlying the surface of the substrate. The device (10) is formed by providing a substrate (12) having a surface (15), depositing a low surface energy material layer (14) and depositing an amorphous carbon layer (16) overlying the surface of the substrate (12) adjacent the low surface energy material layer (14) using plasma enhanced chemical vapor deposition (PECVD) or sputtering.