Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern

摘要

A semiconductor device has a substrate. A conductive via is formed through the substrate. A plurality of first contact pads is formed over a first surface of the substrate. A plurality of second contact pads is formed over a second surface of the substrate. A dummy pattern is formed over the second surface of the substrate. An indentation is formed in a sidewall of the substrate. An opening is formed through the substrate. An encapsulant is deposited in the opening. An insulating layer is formed over second surface of the substrate. A dummy opening is formed in the insulating layer. A semiconductor die is disposed adjacent to the substrate. An encapsulant is deposited over the semiconductor die and substrate. The first surface of the substrate includes a width that is greater than a width of the second surface of the substrate.

主权项

1. A method of making a semiconductor device, comprising:
providing a carrier; providing a substrate; forming a first conductive layer over a first surface of the substrate; forming a second conductive layer over a second surface of the substrate, the second conductive layer including a dummy pattern to approximately balance the second conductive layer with the first conductive layer; disposing the substrate on the carrier; disposing a semiconductor die on the carrier laterally offset from the substrate; and depositing an encapsulant over the carrier between a side surface of the semiconductor die and a side surface of the substrate that opposes the side surface of the semiconductor die.