Methods of forming substrate microvias with anchor structures

摘要

Methods of forming anchor structures in package substrate microvias are described. Those methods and structures may include forming a titanium layer in an opening of a package substrate using a first deposition process, wherein the opening comprises an undercut region, and wherein the first conductive layer does not substantially form in an anchor region of the undercut region. The titanium layer may then be re-sputtered using a second deposition process, wherein the titanium layer is formed in the anchor region.

主权项

1. A method of forming a structure comprising:
forming a first conductive layer in an opening of a package substrate using a first deposition process, wherein the opening comprises an undercut region, and wherein the first conductive layer does not substantially form in an anchor region of the undercut region; and re-sputtering the first conductive layer using a second deposition process, wherein the first conductive layer is formed in the anchor region; forming a second conductive layer on the first conductive layer using a DC power process with no RF bias, wherein the second conductive layer does not form in the anchor region; and re-sputtering the second conductive layer using a DC power process with an RF bias, wherein the second conductive layer forms in the anchor region.