DEPOSITION PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A deposition package and method for manufacturing the same are provided for packaging a center pad chip and a edge pad chip on single semiconductor chip package. CONSTITUTION: A lead on chip type of lead frame includes a downset leading end(11), and an internal lead having a flat region integrally connected to the leading end. A center pad chip(30) having center pads is adhered to the lower surface of the leading end by an insulating adhesive and electrically connected to the upper surface of the leading end by a bonding wire. An edge pad chip(40) having edge pads is adhered to the upper surface of the flat region through an insulating adhesive and electrically connected to the upper surface of the flat region through a bonding wire. An insulation solution is hardened to the leading end, for electrically insulating the center pad chip and the edge pad chip. A molding resin is provided for protecting each of the parts from the outside environment. Thereby, it is possible to improve a mounting density of the package by packaging the center pad chip and the edge pad chip on single semiconductor chip package.