RESIN COMPOSITION, RESIN SHEET, RESIN SHEET WITH METAL FOIL, RESIN CURED ARTICLE SHEET, SEMICONDUCTOR DEVICE FOR POWER SOURCE OR FOR LIGHT SOURCE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition having flexibility before cured and capable of achieving high conductivity after cured, a resin sheet constituted using the resin composition, a resin sheet with a metal foil, a resin cured article sheet and a semiconductor device for a power source or for a light source.SOLUTION: The resin composition is provided that contains: an epoxy resin containing a polyfunctional epoxy resin; a curing agent containing a novolak resin containing monocycle dihydroxybenzene of 20 to 70 wt.%; and an inorganic filler containing nitride particles. The resin composition preferably contains the inorganic filler of 50 to 85 vol.% and preferably contains the polyfunctional epoxy resin of 20 mass% or more in the total epoxy resin. The resin sheet composed of the resin composition, the resin sheet with a metal foil and the semiconductor device are also provided.SELECTED DRAWING: None