IC MODULE, IC CARD, AND IC MODULE SUBSTRATE

摘要

Provided are an IC module, an IC card, and an IC module substrate that can reduce the manufacturing cost without degrading the external appearance of a contact terminal. An IC module includes a contact terminal (10) provided on a front surface (1a) of a base member (1) and having a contact surface, for contact with an external terminal, formed of a gold plating layer (14); an IC chip (55) attached to a back surface (1b) of the base member (1); a conductive member (a wire (60), a first conductive layer (20), and a second conductive layer (30)) connecting the IC chip (55) and the contact terminal (10) to each other through a through hole (3) opened at the front surface (1a) and the back surface (1b) of the base member (1); and an insulating surface material (40) partially covering the front surface (1a). At least a part of a region, overlapping the IC chip (55) in plan view, of the front surface (1a) is set as a non-forming region where a noble metal plating layer is not formed, and the surface material (40) is disposed in the non-forming region.

主权项

1. An IC module characterized by comprising:
a base member provided with a through hole that is opened at a front surface and a back surface; a contact terminal provided on the front surface and configured such that at least a part of a contact surface for contact with an external terminal is formed of a noble metal plating layer; an IC chip attached to the back surface at a position that does not overlap the through hole in plan view; a conductive member connecting the IC chip and the contact terminal to each other through the through hole; and an insulating surface material partially covering the front surface, wherein at least a part of a region, overlapping the IC chip in plan view, of the front surface is set as a non-forming region where the noble metal plating layer is not formed, and the surface material is disposed in the non-forming region.