发明名称 |
LIGHT-EMITTING DIODE MODULE HAVING LIGHT-EMITTING DIODE JOINED THROUGH SOLDER PASTE AND LIGHT-EMITTING DIODE |
摘要 |
Disclosed are a light emitting diode and a light emitting diode module. The light emitting diode module includes a printed circuit board and a light emitting diode joined thereto through a solder paste. The light emitting diode includes a first electrode pad electrically connected to a first conductive type semiconductor layer and a second electrode pad connected to a second conductive type semiconductor layer, wherein each of the first electrode pad and the second electrode pad includes at least five pairs of Ti/Ni layers or at least five pairs of Ti/Cr layers and the uppermost layer of Au. Thus a metal element such as Sn in the solder paste is prevented from diffusion so as to provide a reliable light emitting diode module. |
申请公布号 |
US2016293818(A1) |
申请公布日期 |
2016.10.06 |
申请号 |
US201615186358 |
申请日期 |
2016.06.17 |
申请人 |
Seoul Viosys Co., Ltd. |
发明人 |
Chae Jong Hyeon;Lee Joon Sup;Suh Daewoong;Roh Won Young;Kang Min Woo;Jang Jong Min |
分类号 |
H01L33/62;H01L33/00;H01L33/50;H01L33/38;H01L33/40;H01L33/44;H01L27/15;H01L33/14 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Ansan-si KR |