| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a copper fine particle by which a copper fine particle having an average particle size of less than 100 nm and also a good dispersibility can be stably produced without regard to the particle size of raw material, and to provide conductive paste employing the copper fine particle obtained by the method, and a method for producing conductive paste.SOLUTION: The method for producing a copper fine particle includes a step of reacting a copper source containing a monovalent copper compound with an acid in water, hydrophilic solvent or mixed solvent thereof. The reaction step includes a step of mixing the copper fluid dispersion obtained by dispersing the copper source into the solvent with the acid, and during the mixing step, the mixing is done by ejecting one of the copper fluid dispersion and the acid into the other in a misty shape. |
