发明名称 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce malfunction due to current noise and favorably protect a switching element from overcurrent; and provide a semiconductor module equipped with the semiconductor device.SOLUTION: Provided is a semiconductor device 1 which includes: a semiconductor substrate 6; a switching element formed on the semiconductor substrate 6; and a temperature sense diode 20 which is provided on a surface side of the semiconductor substrate 6 independently from the switching element and which has temperature-dependent characteristics. And provided is a semiconductor module equipped with the semiconductor device 1.SELECTED DRAWING: Figure 5B
申请公布号 JP2016149502(A) 申请公布日期 2016.08.18
申请号 JP20150026756 申请日期 2015.02.13
申请人 ROHM CO LTD 发明人 NAKANO YUUKI
分类号 H01L21/822;H01L21/8234;H01L27/04;H01L27/06;H01L27/088;H01L29/78;H01L29/861;H01L29/868 主分类号 H01L21/822
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