发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce malfunction due to current noise and favorably protect a switching element from overcurrent; and provide a semiconductor module equipped with the semiconductor device.SOLUTION: Provided is a semiconductor device 1 which includes: a semiconductor substrate 6; a switching element formed on the semiconductor substrate 6; and a temperature sense diode 20 which is provided on a surface side of the semiconductor substrate 6 independently from the switching element and which has temperature-dependent characteristics. And provided is a semiconductor module equipped with the semiconductor device 1.SELECTED DRAWING: Figure 5B |
申请公布号 |
JP2016149502(A) |
申请公布日期 |
2016.08.18 |
申请号 |
JP20150026756 |
申请日期 |
2015.02.13 |
申请人 |
ROHM CO LTD |
发明人 |
NAKANO YUUKI |
分类号 |
H01L21/822;H01L21/8234;H01L27/04;H01L27/06;H01L27/088;H01L29/78;H01L29/861;H01L29/868 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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