| 发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
The present disclosure relates to a semiconductor package structure and a method for manufacturing the same. The semiconductor package structure includes a leadframe and a semiconductor die. The leadframe includes a main portion and a protrusion portion. The semiconductor die is bonded to a first surface of the main portion. The protrusion portion protrudes from a second surface of the main portion. The position of the protrusion portion corresponds to the position of the semiconductor die. |
| 申请公布号 |
US2016300782(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201514685529 |
申请日期 |
2015.04.13 |
| 申请人 |
Advanced Semiconductor Engineering, Inc. |
发明人 |
CHEN Tang-Yuan;KAO Chin-Li;CHEN Kuo-Hua;CHEN Ming-Hung;CHEN Dao-Long |
| 分类号 |
H01L23/495;H01L21/56;H01L21/48;H01L23/00;H01L23/31 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package structure, comprising:
a leadframe comprising:
a main portion having a first surface and a second surface; anda protrusion portion protruding from the second surface of the main portion; and a semiconductor die bonded to the main portion, wherein a position of the protrusion portion corresponds to a position of the semiconductor die and the protrusion portion protrudes from the second surface of the main portion below the die. |
| 地址 |
Kaohsiung TW |
