| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly sensitive and high-resolution positive type photosensitive resin composition which is excellent in hardening film property, and which is characterized by the fact that it causes little decrease in the film thickness or no loss of the pattern shape and that there is no scum of the photosensitive resin composition remaining in the exposure part. <P>SOLUTION: The positive type photosensitive resin composition comprises a polyamideimide resin (A), a chemical compound (B) that generates acid by light, a chemical compound (C) having phenolic hydroxyl, and a crosslinking agent (D) that reacts with (A), (B) and (C) by heat. <P>COPYRIGHT: (C)2007,JPO&INPIT |
