| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that when a through hole is formed by forming a resin layer on the opposite sides of a glass substrate and then irradiating with laser light, stress is generated in the glass substrate by deformation of the resin layer during laser irradiation, to cause cracking of the glass substrate, and since the opening size in the resin layer becomes larger than that in the glass substrate, it may be difficult to make the pitch of through holes narrower.SOLUTION: In a method of manufacturing a wiring board, a core substrate having a resin layer formed on the first surface of a glass substrate is prepared, a plurality of through holes are formed in the core substrate by laser irradiation from the second surface where the resin layer is not formed, a connection conductor layer is formed continuously from the surface of the resin layer on the core substrate, and a first conductor layer is formed, as a conductor layer connected with the connection conductor layer, on the first surface of the core substrate, and a second conductor layer is formed on the second surface.SELECTED DRAWING: Figure 1 |
