| 摘要 |
PROBLEM TO BE SOLVED: To measure the width and the depth of a removal region of a processed wafer in a device without providing a new space for an inspection step.SOLUTION: The cutting device comprises: a cutting mechanism (9) for cutting a removal region (62) set on the outer periphery of a wafer (W); a carrying-in and carrying-out arm (7) for holding the outer periphery of the cut wafer (W) so as to be rotatable and carrying the wafer toward a carrying-out cassette (6); and a detection mechanism (17) for detecting the depth and the width of the removal region (62) of the cut wafer (W). The carrying-in and carrying-out arm (7) positions the removal region (62) of the wafer (W) with respect to a detection area of the detection mechanism (17) while carrying the cut wafer (W), and rotates the wafer (W). Thereby, the detection mechanism (17) is structured so as to detect the depth and the width of the removal region (62) over an entire circumference of the wafer (W). |
