发明名称 Back-to-back solid state lighting devices and associated methods
摘要 Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
申请公布号 US9443834(B2) 申请公布日期 2016.09.13
申请号 US201012874396 申请日期 2010.09.02
申请人 Micron Technology, Inc. 发明人 Basceri Cem;Kurth Casey;Tetz Kevin
分类号 H01L25/075;H01L33/38;H05K1/02;H05K1/03 主分类号 H01L25/075
代理机构 Perkins Coie LLP 代理人 Perkins Coie LLP
主权项 1. A solid state light (SSL), comprising: a carrier substrate having a first surface and a second surface different from the first surface, wherein the carrier substrate comprises an electrically insulative material; a first through substrate interconnect (TSI) extending through the electrically insulative material from the first surface of the carrier substrate to the second surface; a second TSI extending through the electrically insulative material from the first surface of the carrier substrate to the second surface; a first solid state emitter (SSE) having a first side and a second side opposite the first side, wherein the second side faces the first surface of the carrier substrate, wherein the first SSE has a first reflective material attached with a first transparent electrically conductive material to the second side, and wherein the first SSE is electrically coupled to the first and second TSIs; and a second SSE having a first side and a second side opposite the first side, wherein the second side faces the second surface of the carrier substrate, wherein the second SSE has a second reflective material attached with a second transparent electrically conductive material to the second side, and wherein the second SSE is electrically coupled to the first and second TSIs, and wherein the electrically insulative material is spaced between the first and second SSEs, wherein the first and second SSEs directly overlap the first and second TSIs.
地址 Boise ID US