| 摘要 |
A chip package including a flexible substrate, a plurality of conductive plugs, a wiring layer, and a chip is provided. The flexible substrate has a first surface and a second surface opposite to the first surface. The conductive plugs pass through the flexible substrate. The wiring layer is located on the first surface and has a plurality of inner leads electrically connected to the conductive plugs respectively. The chip has an active surface and a plurality of bumps on the active surface, wherein the chip is disposed on the second surface of the flexible substrate and connected with the conductive plugs by the bumps. As bumps on the chip are electrically connected to the conductive plugs by hot pressing, the chip is quickly and reliably electrically connected to the inner leads.
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