| 摘要 |
A heat plate construction is provided, which is applicable for being fixed on a circuit board and contacting with a chip to perform a heat exchange. The heat plate construction includes a heat plate body and at least one buffer element. The heat plate body has a plurality of fixing points fixed on the circuit board and located outside the contacting region between the heat plate body and the chip. The buffer element is disposed outside the contacting region between the heat plate body and the chip, and the height of the buffer element is equal to a distance between the heat plate body and the circuit board, such that when the heat plate is dismounted, the buffer element relieves a force for the heat plate to press against the chip, so as to protect the chip from being damaged.
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