发明名称 Low-k dielectric layer based upon carbon nanostructures
摘要 A low-k dielectric material for use in the manufacture of semiconductor devices, semiconductor structures using the low-k dielectric material, and methods of forming such dielectric materials and fabricating such structures. The low-k dielectric material comprises carbon nanostructures, like carbon nanotubes or carbon buckyballs, that are characterized by an insulating electronic state. The carbon nanostructures may be converted to the insulating electronic state either before or after a layer containing the carbon nanostructures is formed on a substrate. One approach for converting the carbon nanostructures to the insulating electronic state is fluorination.
申请公布号 US7233071(B2) 申请公布日期 2007.06.19
申请号 US20040711764 申请日期 2004.10.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 FURUKAWA TOSHIHARU;HAKEY MARK C.;HOLMES STEVEN J.;HORAK DAVID V.;KOBURGER, III CHARLES W.
分类号 H01L23/48 主分类号 H01L23/48
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