| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electrode pin sealing structure of an optical waveguide module capable of attaining enhancement of moisture resistance and disposition suitable for packaging without enlarging its outer size with simple configuration. <P>SOLUTION: The optical waveguide module 1 is provided with an optical waveguide plate 2 comprising heater energizing electrodes for controlling optical waveguide by a thermo-optical effect, optical fibers 3 optically coupled to the optical waveguide plate 2, electrode pins 4 for energizing electrodes, a pair of covers 5 sealing the optical waveguide plate and an adhesive part 50 for sealing preventing infiltration of moisture into the inside of the covers 5. The covers 5 comprise lower and upper covers 51 an 52 disposing the optical waveguide plate 2 in recesses thereof and fitted with each other, and a gap 55 for disposing electrode pins communicating from the recess to an external part is provided in a mutual seam thereof. The electrode pins 4 curved in an L-shape are disposed in the gap 55 for disposing the electrode pins and one ends of the electrode pins are connected to electrodes provided on the optical waveguide plate 2 and the other ends are DIP-disposed and exposed at the external part of the cover parts 5 and sealed along the seam to secure a sealing distance. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
