| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of an electronic-component chip, by relaxing the stresses generated in its protrusion-form electrodes due to its temperature rise occurring in the course of its operation, in an electronic-component mounting structure wherein the electronic-component chip having the plurality of protrusion-form electrodes so disposed as to be distributed over the whole of its mounting surface is mounted on a substrate via the protrusion-form electrodes. <P>SOLUTION: In an integrated-circuit mounting structure 10, solder bumps 1 (1A-1D) are so disposed that the space interposed between the adjacent ones to each other of the bumps 1 becomes small as the space proceeds from the central portion of the mounting surface of an integrated circuit to its outside. For example, the space interposed between the solder bump 1A of the central portion and the solder bump 1B present on the outside thereof is disposed at a pitch P<SB>1</SB>, and the space interposed between the solder bump 1B and the solder bump 1C present on the outside thereof is disposed at a pitch P<SB>2</SB>, and further, the space interposed between the solder bump 1C and the solder bump 1D present on the outside thereof is disposed at a pitch P<SB>3</SB>(wherein P<SB>1</SB>>P<SB>2</SB>>P<SB>3</SB>). <P>COPYRIGHT: (C)2008,JPO&INPIT |
