Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same

摘要

A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.

主权项

1. An article of manufacture comprising:
a first composition including a thermosetting polyorganosiloxane; and a second composition including a thermoplastic polyorganosiloxane, wherein the thermosetting polyorganosiloxane is a siloxane polymer represented by following Formula 1: wherein, R1 to R4 each independently represent a monovalent hydrocarbon having 1 to 8 carbon atoms, m is an integer of 1 to 100, and X indicates a functional group represented by following Formula 2: wherein R5 and R6 each independently represent alkyl or alkoxy having 1 to 4 carbon atoms, k is an integer of 0 to 2, n is 0 or 1, and Y indicates a functional group represented by one of following Formulas 3 to 5:and
wherein the thermoplastic polyorganosiloxane includes: about 0.1 to about 4.0 mol % of a monofuntional siloxane unit(s); about 88.8 to about 99.8 mol % of a bifunctional siloxane unit(s); and about 0.1 to about 8.0 mol % of a tetrafunctional siloxane unit(s).