发明名称 WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a wiring board wherein poor weld between a bus bar and an electric wire is positively prevented. SOLUTION: Bus bars 25 and 26 are buried in insulating boards 23 and 24 so that part of the bus bars are exposed, and exposed portions 25b and 26b of the bus bars 25 and 26, exposed at the surfaces of the insulating board 23 and 24 and the connecting portion 37b of an electric wire 37 wired on the insulating board 23 and 24, are jointed with each other with a pair of electrodes 38 and 39 sandwiched in-between for welding to form a wiring board 21 and 22. In the wiring boards 21 and 22, connecting holes 33 and 34, larger in diameter than the individual electrodes 38 and 39, are formed around the exposed portions 25b and 26b of the bus bars 25 and 26 of the insulating boards 23 and 24, and the exposed portions 25b and 26b of the bus bars 25 and 26 are completely exposed in the connecting holes 33 and 34.</p>
申请公布号 JP2001327041(A) 申请公布日期 2001.11.22
申请号 JP20000140702 申请日期 2000.05.12
申请人 YAZAKI CORP 发明人 MURAKOSHI HIROYUKI
分类号 H01R9/03;H01R4/02;H02G3/16;(IPC1-7):H02G3/16 主分类号 H01R9/03
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