发明名称 |
POLISHING HEAD FOR SEMICONDUCTOR WAFER, POLISHING APPARATUS AND POLISHING METHOD |
摘要 |
<p>The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.</p> |
申请公布号 |
EP1860689(A1) |
申请公布日期 |
2007.11.28 |
申请号 |
EP20060714954 |
申请日期 |
2006.03.01 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
HASHIMOTO, HIROMASA;ARIGA, YASUHARU;MASUMURA, HISASHI;KITAGAWA, KOUZI;KUBOTA, TOSHIMASA;MATSUDA, TAKAHIRO |
分类号 |
H01L21/304;B24B37/005;B24B37/30;B24B53/017 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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