发明名称 |
METHOD FOR SOLDERING TOGETHER TWO SURFACES AND A DEVICE COMPRISING TWO SURFACES SOLDERED TOGETHER |
摘要 |
The invention relates to a method for connecting a first surface ( 20 ) to a second surface in a soldering process by use of a solder containing melting point reducer. The invention also relates to a device having a first surface ( 20 ) and a second surface, which surfaces are connected to one another by soldering with a solder containing melting point reducer. The first surface ( 20 ) borders on a structure ( 15 a-f), part of which is brought into communication with the solder in order to transfer solder to the first surface. The structure ( 15 a-f) is partly in communication with the solder, which solder is connected to the first surface ( 20 ). |
申请公布号 |
EP1883489(A1) |
申请公布日期 |
2008.02.06 |
申请号 |
EP20060733415 |
申请日期 |
2006.05.19 |
申请人 |
ALFA LAVAL CORPORATE AB |
发明人 |
SJOEDIN, PER;RASSMUS, JENS |
分类号 |
B23K1/00;B23K1/20;F28D9/00 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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