发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN AND ELECTRONIC DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To further improve sensitivity and resolution in relation to a positive photosensitive resin composition which is developable with an aqueous alkali solution. <P>SOLUTION: The positive photosensitive resin composition comprises: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a compound which generates an acid under light; (C) an elastomer; (D) a low molecular compound having a phenolic hydroxyl group; and (E) a solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008309885(A) |
申请公布日期 |
2008.12.25 |
申请号 |
JP20070155384 |
申请日期 |
2007.06.12 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
MATSUTANI HIROSHI;UENO TAKUMI;ALEXANDRE NICOLAS |
分类号 |
G03F7/023;G03F7/004;H01L21/027 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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