发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN AND ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To further improve sensitivity and resolution in relation to a positive photosensitive resin composition which is developable with an aqueous alkali solution. <P>SOLUTION: The positive photosensitive resin composition comprises: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a compound which generates an acid under light; (C) an elastomer; (D) a low molecular compound having a phenolic hydroxyl group; and (E) a solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008309885(A) 申请公布日期 2008.12.25
申请号 JP20070155384 申请日期 2007.06.12
申请人 HITACHI CHEM CO LTD 发明人 MATSUTANI HIROSHI;UENO TAKUMI;ALEXANDRE NICOLAS
分类号 G03F7/023;G03F7/004;H01L21/027 主分类号 G03F7/023
代理机构 代理人
主权项
地址