| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a cleaning work time by solving a problem wherein, in a conventional bonding device, ultrasonic cleaning is executed by installing a cleaning bath on a bonding stage, and immersing a tool in a cleaning fluid in the cleaning bath, but it takes a certain length of time to do it. <P>SOLUTION: This bonding device includes: a bonding stage 20 for mounting a semiconductor element 52 thereon; a tool 13 ultrasonically jointing an aluminum tape to the semiconductor element by bringing the aluminum tape 15 into press contact with the semiconductor element and applying ultrasonic vibration to the aluminum tape; a bonding head 11 having the tool mounted thereto, provided with an ultrasonic oscillator 12, and relatively movable with respect to the bonding stage 20; and a bulk material 30 installed in a bonding area allowing the bonding head to be moved therein, and allowing a bonding operation by the tool. In the bonding device, the bulk material is formed with a member having a hardness higher than that of the aluminum tape, and the tool is composed to be able to execute a bonding operation to the bulk material. <P>COPYRIGHT: (C)2009,JPO&INPIT |
