发明名称 Liquid ejection head and liquid ejection apparatus
摘要 A liquid ejection head includes a substrate in which a pressure generating chamber that communicates with a nozzle opening is formed; and a piezoelectric element having a piezoelectric layer, a first electrode that is formed on a surface of the piezoelectric layer on a side of the substrate so as to correspond to the pressure generating chamber, and a second electrode that is formed on a surface of the piezoelectric layer opposite to the side on which the first electrode is formed so as to extend over a plurality of the pressure generating chambers, wherein the second electrode is formed to extend to an outside of the pressure generating chamber in a longitudinal direction of the pressure generating chamber.
申请公布号 US9498952(B2) 申请公布日期 2016.11.22
申请号 US201514941929 申请日期 2015.11.16
申请人 Seiko Epson Corporation 发明人 Hirai Eiju;Yazaki Shiro;Sumi Koji;Takabe Motoki;Kato Jiro;Ito Hiroshi;Shimizu Toshihiro;Kamijo Takahiro;Torimoto Tatsuro;Kojima Chikara
分类号 B41J2/14;B41J2/045;B41J2/16;H01L41/08 主分类号 B41J2/14
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A piezoelectric device comprising: a substrate; a plurality of chambers, a part of each of the plurality of chambers being included in the substrate; a vibration plate on the substrate, the vibration plate having a plurality of deformation sections that respectively flex into the plurality of chambers; a plurality of first electrodes on the vibration plate so as to respectively correspond to the plurality of deformation sections; a second electrode above the plurality of first electrodes so as to extend over the plurality of deformation sections; a piezoelectric layer interposed between the plurality of first electrodes and the second electrode; and a metal layer on the second electrode and configured to serve as a wiring, wherein the second electrode extends, in a longitudinal direction of the chamber, beyond an end of each of the plurality of deformation sections in a plan view, and the metal layer is formed at a position across an inside and an outside of the chamber.
地址 JP