| 摘要 |
A device placement or diebonding head (2) including a rod-and-piston combination including gas pressure applying inlet above (21) or below (17) the piston (4) and gas pressure opposing source, e.g., an independent gas pressure source or springs (20, 20a), to control vertical movement of the vacuum tool (6). Force exerted by the vacuum tool (6) on the device (8) being diebonded to substrate (9) is adjustable by adjusting the gas pressure on the piston (4) relative to the force of the pressure resisting source, e.g., springs (20, 20a). As the device (8) is bonded, a pressure sensure (29) may control a system to relieve the pressure exerted by the piston (4) on the device due to thermal expansion.
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