Ultrasonic jet semiconductor wafer cleaning apparatus

摘要

An ultrasonic jet semiconductor wafer cleaning apparatus for removing debris from a surface of a semiconductor wafer as the wafer is rotated about a prescribed axis in a cleaning plane is disclosed. The apparatus comprises a housing having a principal axis, an inlet port, and an outlet port; a means for producing focused ultrasonic waves of acoustic energy concentric with and incident the outlet port to form a jet stream of cleaning liquid released through the outlet port; a focal point positioning means for adjustably positioning a focal point of the focused ultrasonic wave producing means between a first focal point position and a second focal point position along an axis; and a means coupled to the housing for sweeping the housing in an reciprocating manner along a sweep path.