发明名称 FILM BONDING DEVICE AND FILM PRODUCTION
摘要 PROBLEM TO BE SOLVED: To provide a film bonding device capable of improving the product quality and producing a film at a high speed by preventing troubles generated when a solution film is bonded to the cast surface. SOLUTION: A film bonding device for bonding a solution film 3 extruded from a slit gap of a mouth piece against the surface of a moving cast has negative pressure areas 4, 5 each having an independent suction port upstream of the mouth piece in a direction in which the cast moves from a point wherein the solution film 3 is bonded to the cast surface and independent pressure reducing means, respectively, wherein at least one 4 of the negative pressure areas has a contact portion with the solution film 3 and the other negative pressure area 5 does not have a contact portion with the solution film 3.
申请公布号 JPH10323854(A) 申请公布日期 1998.12.08
申请号 JP19980082278 申请日期 1998.03.27
申请人 TORAY IND INC 发明人 NISHIDA TAKANORI;NISHITANI TOSHIO;YOSHIMURA YUJI
分类号 B29C41/28;B29C41/50;B29L7/00;(IPC1-7):B29C41/50 主分类号 B29C41/28
代理机构 代理人
主权项
地址