| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage and disconnection of a circuit pattern of a flexible circuit substrate produced by stress in folding the flexible circuit substrate. SOLUTION: A junction part including lead terminal rows 42 for output electrically connected to connection terminal rows 11 of a TFT (thin film transistor) array substrate 1, and a part covered with solder resist 7 are included on a part of a TCP (tape carrier package) 4 overlapping with the TFT array substrate 1. On a part of the TFT array substrate 1 overlapping with the solder resist 7, stiffness (strength) of a folded part of the TCP 4 including a part in contact with an end edge part 1a of the TFT array substrate 1 is increased and the circuit pattern 6 hardly buckles. Also, because the end edge part 1a of the TFT array substrate 1 is not directly in contact with the circuit pattern 6 of the TCP 4, the end edge part 1a of the substrate is not scratched, and the damage and the disconnection of the circuit pattern 6 of the TCP 4 produced by stress in folding the TCP 4 is prevented. COPYRIGHT: (C)2005,JPO&NCIPI
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