发明名称 METHOD FOR TREATING SURFACE OF GOLD
摘要 <P>PROBLEM TO BE SOLVED: To normally form a bonding wire and an electrodeposition film on a surface of a structure made of gold, even after treatment with oxygen which has been turned in an activated state. <P>SOLUTION: A control electrode 118 and a movable portion electrode 109 are irradiated with oxygen plasma, to remove residual carbon based contamination (organic substances) on their surfaces. Then the substrate 101, treated with the oxygen plasma, is immersed in hydrochloric acid solution adjusted around pH4.8, for example, to allow the hydrochloric acid to act on the surfaces of the control electrode 118 and the movable portion electrode 109. According to this acid treatment, gold oxide formed by the irradiation with oxygen-containing plasma on the surfaces of the control electrode 118, and the movable portion electrode 109 made of gold is removed. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010021592(A) 申请公布日期 2010.01.28
申请号 JP20090247486 申请日期 2009.10.28
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 SAKATA TOMOMI;ISHII HITOSHI;SATO NORIO;KUWABARA HIROSHI;MACHIDA KATSUYUKI
分类号 H01L21/60 主分类号 H01L21/60
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