Microbump and sacrificial pad pattern

摘要

Embodiments described herein generally relate to connections for integrated circuit (IC) dies. For example, in an embodiment an integrated circuit (IC) die is provided. The IC die includes a plurality of clusters of pads formed on a surface of the IC die, each cluster being associated with a respective circuit formed in the IC die. Each cluster includes a plurality of micropads each electrically coupled to the circuit associated with the cluster through a respective via and a sacrificial pad coupled to the circuit through the plurality of micropads, the sacrificial pad being larger than each of the micropads.

主权项

1. An integrated circuit (IC) die, comprising:
a plurality of clusters of pads, formed on a surface of the IC die, associated with a plurality of circuits formed in the IC die, wherein each cluster of pads from among the plurality of clusters of pads comprises:
a plurality of micropads formed on the surface of the IC die, each micropad from among the plurality of micropads being physically and electrically coupled to a respective circuit from among the plurality of circuits through a respective via or trace from among a plurality of vias or traces; anda sacrificial pad, formed on the surface of the IC die, electrically coupled to the respective circuit through the plurality of micropads, the sacrificial pad having a surface area that is different from a surface area of each micropad from among the plurality of micropads.