MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

A multilayer substrate including a multilayer body formed by laminating a plurality of insulating layers including via holes in the insulating layer as an uppermost layer of the multilayer body so as to pass through the insulating layer, and via conductors formed by filling the via holes with a conductive paste. The via holes are formed through lower end positions, upper end positions, and intermediate positions between the lower end positions and the upper end positions such that a diameter enlargement degree toward the upper end positions from the intermediate positions is larger than a diameter enlargement degree toward the intermediate positions from the lower end positions. By forming the via holes as described above, when the via holes are filled with the conductive paste from openings at the small diameter side of the via holes, exudation of the conductive paste from openings at the large diameter side is prevented.

主权项

1. A multilayer substrate including a multilayer body having a plurality of laminated insulating layers, the multilayer substrate comprising:
a via hole provided in a predetermined insulating layer which has been previously determined among the plurality of insulating layers so as to pass through the predetermined insulating layer; and a via conductor provided as a conductive paste filling the via hole, wherein the via hole is provided through a lower end position, an upper end position, and an intermediate position between the lower end position and the upper end position such that a diameter enlargement degree toward the upper end position from the intermediate position is larger than a diameter enlargement degree toward the intermediate position from the lower end position.