| 摘要 |
<p>PURPOSE: To obtain a semiconductor device in which the effect of noise on the inner circuit can be suppressed. CONSTITUTION: The semiconductor device 5 comprises a package frame 1, a bonding wire 3, a pad 11, first inner power supply line 13, second inner power supply line 15, an inner circuit 21, a stabilization circuit 23, a GND package frame 7, a GND bonding wire 9, a GND pad 17, and an inner GND line 19. The bonding wire 3, the pad 11, the first inner power supply line 13, and the second inner power supply line 15 serve as a filter. Consequently, the noise generated upon operation of the inner circuit 21 is absorbed by the stabilization circuit 23 when the noise propagates through the first inner power supply line 13, the pad 11 and the second inner power supply line 15 thus suppressing the effect of noise on the stabilization circuit 23.</p> |
