LEAD FRAME

摘要

Disclosed herein is a lead frame. The lead frame comprises: a plurality of leads electrically connected to a semiconductor chip; a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads, and an adhesive layer disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads; and at least one line electrically connecting the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability.