| 摘要 |
PROBLEM TO BE SOLVED: To provide an electromagnetic field coupling structure and a multilayer wiring board using the same capable of reducing a transfer loss in a slot coupling structure and excellent even on a multilayer wiring board with wiring layers of four layers or more. SOLUTION: A slot coupling type interlayer connection structure 100 is formed by laminating: a first transmission line 2A; a first dielectric substrate 1A; a first earth conductor 3A having a slot 4A; a second dielectric substrate 1B; a second earth conductor 3B having a slot 3B at a position corresponding to a slot 3A; a third dielectric substrate 1C; and a second transmission line 2B in this order, wherein the first earth conductor 3A and the second earth conductor 3B are electromagnetically connected through a pair of slots 4A and 4B, thereby electrically connecting the first transmission line 2A and the second transmission line 2B. Each of the first earth conductor 3A and the second earth conductor 3B is electrically connected to a via hole group 5 periodically formed in a circumference of its slot. COPYRIGHT: (C)2007,JPO&INPIT |
