| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of improving productivity by forming dams and printing bumps for interlayer conduction in the dams, and of solving the problem of expansion of the bump; and a manufacturing method thereof. <P>SOLUTION: This manufacturing method of a printed circuit board is used for manufacturing this printed circuit board by forming the bumps 30 for interlayer conduction on one-side surface of a board 20a, and stacking an insulation layer 20b on the one-side surface of the board, and is characterized by including steps of: forming, on the one-side surface of the board, the dams 24 surrounding regions corresponding to the bumps; forming the bumps 30 by printing conductive pastes 30a and 30b on the regions corresponding to the bumps; and stacking the insulation layer 20b on the one-side surface of the board. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
