发明名称 Flexible printed wiring board
摘要 A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
申请公布号 US7312401(B2) 申请公布日期 2007.12.25
申请号 US20050229672 申请日期 2005.09.20
申请人 IBIDEN CO., LTD. 发明人 TSUKADA KIYOTAKA;NINOMARU TERUMASA;KIZAKI MASAKI
分类号 H05K1/00 主分类号 H05K1/00
代理机构 代理人
主权项
地址