| 摘要 |
<p>PURPOSE:To form easily a semiconductor device having a high accuracy and a high rigidity by a method wherein a necessary type of a lead pin is soldered to a land under the lower end of a through hole in a ceramic package substrate and a prescribed pin fixing plate is fixed with a resin filler. CONSTITUTION:A nail head type outer lead pin 7 having a nail head 8 is fixed to a land 5 under the lower part of a through hole 4 in a ceramic package substrate 1 by a solder. Then, when a pin fixing plate 9, which is provided with a through hole identical with the hole 4 and has the same external shape as that of the substrate 1, is fixed with a resin filler 12, a high-temperature brazing and the like are not needed and a pin grip array(PGA) type semiconductor device, which has a high accuracy, a high rigidity and a high reliability, is obtained.</p> |
