| 摘要 |
PURPOSE: To provide an apparatus for recovering wafer of a slicing machine capable of improving a collecting rate of the wafer by a method wherein though a cut thickness of the wafer is varied, a suitable clearance can be automatically formed between an end surface of the wafer and a pad surface of a recovering plate, and besides the clearance can be corrected according to cutting information. CONSTITUTION: Movement of a recovering plate 23 wherein a surface of a pad 23A is approached to or evacuated from an end surface on a cut side of an ingot 20, is carried out by a servo mechanism 24. Besides, the servo mechanism 24 is controlled so that a set clearance preliminarily set is formed between a bottom surface of the wafer 22 cut in recovering the wafer based on a thickness of the wafer 22 and a surface of the pad 23A of the recovering plate 23. Further, the set clearance is corrected based on cutting information influencing recovering precision of the wafer. |
