发明名称 |
Electronic configuration with flexible bonding pads |
摘要 |
An electronic configuration has a first surface with electrical contacts for electrical bonding. The configuration includes at least one flexible elevation made of an insulating material that is arranged on the first surface. The flexible elevation has at least one recess and the surface of the flexible recess is at least partially covered with an electrically conductive material to form one of the electrical contacts.
|
申请公布号 |
US2002094707(A1) |
申请公布日期 |
2002.07.18 |
申请号 |
US20010022606 |
申请日期 |
2001.12.17 |
申请人 |
HEDLER HARRY |
发明人 |
HEDLER HARRY |
分类号 |
H01L21/60;H01L23/485;H01L23/498;H01R12/04;H01R13/03;H01R13/24;H05K3/32;(IPC1-7):H05K1/00 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|