Method for manufacturing a three-dimensional interconnected support for light emitting diodes

摘要

The method involves flexing notches of a lower layer (501) of a substrate (500) to deform the lower layer without rupturing an upper layer (503). LEDs are arranged on the upper layer. The substrate (500) is arranged along two different maintenance planes (P1,P2). The changing of level between two successive maintenance planes is ensured by presence of the notches of lower layer to deform the substrate.