SUBSTRATE INSPECTION METHOD, SUBSTRATE PROCESSING SYSTEM AND COMPUTER RECORDING MEDIUM

摘要

PROBLEM TO BE SOLVED: To appropriately inspect substrates in a substrate processing system.SOLUTION: A wafer inspection method in a substrate processing system including a plurality of processing devices implementing prescribed processing to wafers is configured to: photograph a surface of a wafer before processed by the processing device to acquire a first substrate image (step S1); extract a prescribed amount of character from the first substrate image (step S2); select an inspection recipe corresponding to the amount of characteristic extracted from the first substrate image from a storage unit in which a plurality of inspection recipes set in accordance with the amount of characteristic of respective different ranges is stored (steps S3 and S4); photograph the surface of the wafer after processed by the processing device to acquire a second substrate image (step S6); and determine presence or absence of wafer defects on the basis of the selected inspection recipe and the second substrate image (step S7).SELECTED DRAWING: Figure 8