发明名称 CORE PIN COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To selectively cool core pins, which tends to overheat, by a method wherein a cooling block, which shifts from outside a mold clamping area into the mold clamping area under the state that a fixed mold and a movable mold are open so as to come into contact with the core pins in order to forcibly cool the core pins through heat conduction, is provided. SOLUTION: A core pin cooling device 1 is provided shiftably by means of the arm 11 of a multispindle robot means or the like under the state that a fixed mold 52 and a movable mold 53 are open. The core pin cooling device 1 is equipped with a heat exchanging cooling plate 2, and a cooling block 3 which forcibly cools core pins 55... through heat conduction, The cooling block 3 consists of a lump-like body having a high heat conductivity and a flexibility so as to deform in response to the shapes of the core pins 55... in order to convey the core pins 55... with the block, resulting in enlarging the contact area with the core pins 55....
申请公布号 JP2000318010(A) 申请公布日期 2000.11.21
申请号 JP19990128898 申请日期 1999.05.10
申请人 MATSUI MFG CO 发明人 MATSUI HIRONOBU
分类号 B29C45/73;B29C33/02;(IPC1-7):B29C45/73 主分类号 B29C45/73
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