| 摘要 |
PROBLEM TO BE SOLVED: To provide a nozzle device which can solve current problems in the prior art, be suitably used for single wafer cleaning in manufacturing a semiconductor integrated circuit or the like, and have a high cleaning capability; and also to provide a cleaning apparatus comprising the nozzle device. SOLUTION: The nozzle device comprises a nozzle main body 52 of a nearly cylindrical shape and a cup member 54 located within the cylinder of the nozzle main body to be drivingly rotated for ejecting liquid droplets from its tip end. Two or more fluids containing a cleaning solution and a gas are mixed, and are ejected from the tip end of the nozzle. COPYRIGHT: (C)2007,JPO&INPIT
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