| 摘要 |
PROBLEM TO BE SOLVED: To detect a wafer center position with high detection accuracy. SOLUTION: The method of manufacturing a semiconductor device includes a step of preparing a circular plate wafer (semiconductor wafer) 20 and a step of previously detecting the central position C of the wafer 20 before positioning the wafer 20. Herein, in the step of detecting the central position C of the wafer 20, first an image processing apparatus obtains image data 20g of part of the wafer 20 including an edge (outer edge) 20e of the wafer 20. Then, using image processing apparatus taking as a center a plurality of coordinate points 20h constructing the edge 20e of the wafer 20. There are estimated a plurality of circular arc orbits (orbit of circular arc) 20k that have a radius equal to the radius r of the wafer 20. Then, by using the image processing apparatus, the center position C of the wafer 20 is calculated by estimating the intersections of the plurality of circular arc orbitals 20k. COPYRIGHT: (C)2010,JPO&INPIT |
