| 摘要 |
Photodetector 1 is equipped with photodiodes PDn, integrating circuits 10 n, CDS circuits 20 n, and hold circuits 30 n. Each integrating circuit 10 n includes an amplifier 11 n, a capacitor C, and a switch SW. Photodiodes PDn are aligned on a first substrate 100 . A differential pair input part (transistors T<SUB>1 </SUB>and T<SUB>2</SUB>) of amplifier 11 n, capacitor C, etc., of each integrating circuit 10 n are disposed on a second substrate 200 . A drive part (transistors T<SUB>5 </SUB>and T<SUB>6</SUB>) of amplifier 11 n, etc., of each integrating circuit 10 n are disposed on a third substrate 300.
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