摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device which has high power efficiency by improving reflectance on an element mounting surface where a light-emitting element is mounted, in a package and is capable of easily radiating heat generated in the light-emitting element.SOLUTION: The light-emitting device comprises: the package including a resin part 10 and one or more lead frames 20 and 22 disposed within the resin part; and a light-emitting element 50 that is electrically connected with at least one of the lead frames. At least one of the lead frames includes at least one projection 22b on its top face. A side face of the at least one projection is surrounded by the resin part, and a projection top face that is a top face of the projection is exposed from the resin part. The light-emitting element is mounted on the projection top face and at least half of an area of the projection top face is covered by the light-emitting element.SELECTED DRAWING: Figure 2 |